102,429 research outputs found

    Principles and applications of CVD powder technology

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    Chemical vapor deposition (CVD) is an important technique for surface modification of powders through either grafting or deposition of films and coatings. The efficiency of this complex process primarily depends on appropriate contact between the reactive gas phase and the solid particles to be treated. Based on this requirement, the first part of this review focuses on the ways to ensure such contact and particularly on the formation of fluidized beds. Combination of constraints due to both fluidization and chemical vapor deposition leads to the definition of different types of reactors as an alternative to classical fluidized beds, such as spouted beds, circulating beds operating in turbulent and fast-transport regimes or vibro-fluidized beds. They operate under thermal but also plasma activation of the reactive gas and their design mainly depends on the type of powders to be treated. Modeling of both reactors and operating conditions is a valuable tool for understanding and optimizing these complex processes and materials. In the second part of the review, the state of the art on materials produced by fluidized bed chemical vapor deposition is presented. Beyond pioneering applications in the nuclear power industry, application domains, such as heterogeneous catalysis, microelectronics, photovoltaics and protection against wear, oxidation and heat are potentially concerned by processes involving chemical vapor deposition on powders. Moreover, simple and reduced cost FBCVD processes where the material to coat is immersed in the FB, allow the production of coatings for metals with different wear, oxidation and corrosion resistance. Finally, large-scale production of advanced nanomaterials is a promising area for the future extension and development of this technique

    CVD of pure copper films from amidinate precursor

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    Copper(I) amidinate [Cu(i-Pr-Me-AMD)]2 was investigated to produce copper films in conventional low pressure chemical vapor deposition (CVD) using hydrogen as reducing gas-reagent. Copper films were deposited on steel, silicon, and SiO2/Si substrates in the temperature range 200–350°C at a total pressure of 1333 Pa. The growth rate on steel follows the surface reaction between atomic hydrogen and the entire precursor molecule up to 240°C. A significant increase of the growth rate at temperatures higher than 300°C was attributed to thermal decomposition of the precursor molecule. It is shown that [Cu(i-Pr-Me-AMD)]2 meets the specifications for the metal organic chemical vapor deposition of Cu-based alloy coatings containing oxophilic elements such as aluminum

    Silicon nanowire devices

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    Transport measurements were carried out on 15–35 nm diameter silicon nanowires grown using SiH4 chemical vapor deposition via Au or Zn particle-nucleated vapor-liquid-solid growth at 440°C. Both Al and Ti/Au contacts to the wires were investigated. The wires, as produced, were essentially intrinsic, although Au nucleated wires exhibited a slightly higher conductance. Thermal treatment of the fabricated devices resulted in better electrical contacts, as well as diffusion of dopant atoms into the nanowires, and increased the nanowire conductance by as much as 10^4. Three terminal devices indicate that the doping of the wires is p type

    Intrinsic thermal vibrations of suspended doubly clamped single-wall carbon nanotubes

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    We report the observation of thermally driven mechanical vibrations of suspended doubly clamped carbon nanotubes, grown by chemical vapor deposition (CVD). Several experimental procedures are used to suspend carbon nanotubes. The vibration is observed as a blurring in images taken with a scanning electron microscope. The measured vibration amplitudes are compared with a model based on linear continuum mechanics.Comment: pdf including figures, see: http://www.unibas.ch/phys-meso/Research/Papers/2003/NT-Thermal-Vibrations.pd

    Metal-catalyzed crystallization of amorphous carbon to graphene

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    Metal-catalyzed crystallization of amorphous carbon to graphene by thermal annealing is demonstrated. In this "limited source" process scheme, the thickness of the precipitated graphene is directly controlled by the thickness of the initial amorphous carbon layer. This is in contrast to chemical vapor deposition processes, where the carbon source is virtually unlimited and controlling the number of graphene layers depends on the tight control over a number of deposition parameters. Based on the Raman analysis, the quality of graphene is comparable to other synthesis methods found in the literature, such as chemical vapor deposition. The ability to synthesize graphene sheets with tunable thickness over large areas presents an important progress toward their eventual integration for various technological applications.open826

    Optical characterization of a-Si : H thin films grown by Hg-Photo-CVD

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    Mercury-Sensitized Photo-Assisted Chemical Vapor Deposition (Hg-Photo-CVD) technique opens new possibilities for reducing thin film growth temperature and producing novel semiconductor materials suitable for the future generation of high efficiency thin film solar cells onto low cost flexible plastic substrates. This paper provides some experimental data resulting from the optical characterization of hydrogenated amorphous silicon thin films grown by this deposition technique. Experiments have been performed on samples deposited at different temperatures, with and without thermal annealing.Mercury-Sensitized Photo-Assisted Chemical Vapor Deposition (Hg-Photo-CVD) technique opens new possibilities for reducing thin film growth temperature and producing novel semiconductor materials suitable for the future generation of high efficiency thin film solar cells onto low cost flexible plastic substrates. This paper provides some experimental data resulting from the optical characterization of hydrogenated amorphous silicon thin films grown by this deposition technique. Experiments have been performed on samples deposited at different temperatures, with and without thermal annealing

    Annealing process to stabilize PECVD silicon nitride for application as the gate dielectric in MOS devices

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    Describes a process by which thin films of silicon nitride are deposited on silicon substrates by plasma enhanced chemical vapor deposition techniques, stabilized by post-deposition rapid thermal annealing at temperatures ranging from about 600° C to about 700° C and at times ranging from about 3 seconds to about 30 seconds
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